Advanced Semiconductor and Packaging Technology
Advanced Semiconductor and Packaging Technology
Explore advanced semiconductor packaging technologies, including electrical and thermal design, reliability analysis, and cutting-edge techniques like 3D and co-packaged optics—enhanced by TCAD/ANSYS simulations and hands-on labs for real-world applications in AI hardware, HPC, and next-gen electronics.
Register Before June 27, 2025
Registrations closed
Programming in Python
This course is a concise yet comprehensive program tailored for B.Tech/MCA/BCA/M.Tech students and corporate professionals. Covering Python fundamentals, control flow, functions, file handling, and object-oriented concepts, participants gain hands-on experience to code, analyze data, and develop applications efficiently. No prior experience required, making it ideal for beginners and experienced programmers alike.
Program Date
June 30, 2025 -
July 07, 2025
Learning Format
Online Live
Learning
Program Duration
40 hours of lectures & hands-on sessions
Course Price
Academic: ₹500
Professional: ₹1500
Our Alumni Work At
Course Objectives:
Provide in-depth knowledge of semiconductor packaging technologies.
Familiarize participants with electrical, thermal, and reliability design of IC packages.
Demonstrate TCAD, FEM, and ANSYS tools for simulation and modeling.
Explore challenges in underfill flow, heat dissipation, and fatigue failures.
Develop practical skills through hands-on lab problems and simulations.
Understand advanced topics like 3D, fan-out, and co-packaged optics.
Bridge the gap between academic understanding and industry-level applications.
Course Curriculum
Semiconductor Packaging Materials and Technologies
Learn about the types, properties, and applications of modern materials used in semiconductor packaging.
Electrical and Thermal Design Considerations
Understand how to design IC packages for optimal electrical performance and efficient heat dissipation.
TCAD and ANSYS-based Simulation Methods
Gain hands-on experience with simulation tools for analyzing semiconductor devices and packaging structures.
High-Density Substrates and Interconnections
Explore advanced substrate technologies and techniques for compact, high-performance interconnect layouts.
Reliability Analysis and Failure Mechanisms
Study testing methods and diagnostic tools to evaluate long-term reliability and identify common failure modes.
Advanced Packaging Techniques (3D, Co-Packaged Optics)
Dive into cutting-edge methods like 3D packaging, fan-out, and integrated optical systems for high-speed applications.
Real-Time Problem Solving & Hands-On Experiments
Apply theoretical knowledge through practical sessions focused on real-world engineering problems and lab simulations.
Program Outcomes
Analyze and simulate packaging-related thermal and electrical issues
Gain expertise in reliability testing and identifying failure modes
Apply FEM tools for evaluating thermal dissipation
Solve complex packaging problems using software and lab techniques
Understand interconnection technologies and manufacturing steps
Translate theoretical knowledge into practical engineering solutions
Certification Benfits
- Enhanced career opportunities
- E&ICT Adacemy, IIT Kanpur Certification
- Recognition and credibility in the industry
- Skill development and professional growth
Prerequisites
- No experience is required. But fundamental knowledge of C/C++ and statistics would be helpful.
Admission Closes on 5 March
Skills Covered
- Business Strategic & Analytics
- Operations Management
- Decision Making Tools
- Finance & Economics
- Marketing Management
- Organizational Behavior and Design
- Human Resource Management
- Breakthrough Management
- Management Communication
- Green Manufacturing
- Ethics & Values in Business
- Interpersonal Skills & Leadership
- Vision to Execution Entrepreneurship
- Micro and Macro Economics
- Leadership & Decision Making
- Frontier Technologies in Manufacturing
- Strategies for Managing Innovation
- Technology Management
- Advance Materials
- Automation & Robotics in Manufacturing
- Computer Integrated Manufacturing Systems
Know your faculty
Prof. Amey Karakare
Prof. Amey Karakare is a Head Of The Department (HOD) for CSE branch at IIT Kanpur. Developed and maintains Prutor, a renowned Learning Management System (LMS) for programming courses, enhancing the learning experience for students and streamlining tasks for instructors since 2013. Recognized with prestigious awards including the 1989 Batch Faculty Award from IITK Alumni Association and the Best Faculty of the Year 2018 award from the Computer Society of India’s Mumbai Chapter. Offers popular online Python courses that have garnered significant popularity among Indian students and faculty members. Conducts Faculty Development Workshops on diverse topics, including Python programming, Machine Learning, and High-Performance Computing, contributing to educational advancement. Key involvement in high-impact projects sponsored by government agencies, such as setting up Rashtriya Avishkar Labs in over 150 schools and leading the Electronics and ICT Academy at IIT Kanpur, dedicated to training faculty and students.
Who Should Enroll?
- This course is open to faculty members, PhD scholars, UG and PG students, as well as industry professionals interested in advanced semiconductor and packaging technologies.
Prerequisites:
No specific experience required
Basic knowledge of any programming language is helpful
Course Coordinator & Mentors
Principal Coordinator
- Prof. Sanjeev Manhas, Head, ECE, Dept., IIT Roorkee
Joint Principal Coordinator
- Prof. Sanjeev Manhas, Head, ECE Dept., IIT Roorkee
- Dr Pushpa Raikwal, IIITDM
- Dr. Deepak Bharti, MNIT, Jaipur
- Dr. Bambam Kumar, NIT Patna
- Dr. B V Phani , IIT Kanpur
List of Resource Persons
- Prof. Sanjeev Manhas, IIT Roorkee
- Dr. Pradeep Dixit, IIT Bombay
Course Fee
TOTAL PROGRAM FEE
For Academic (Faculty / Students) : ₹500 (Inc. GST)- For Industry Professional: ₹1000 (Inc. GST)
- Course Type: Online Live
- Certificate: Yes
- Start Date: June 30 – July 07, 2025
- Duration: 40 hours of lectures, hands-on, pedagogy/industry sessions
- Deadline: June 27, 2025
Data Science Course Fee
- A bachelor's degree with an average score of at least 50%
- Prior knowledge or experience in programming and mathematics
- 2+ years of formal work experience (preferred)
Best Suited For
- Software Engineers
- Freshers
- BI Developers
Important Dates
22nd September, 2022 (Thursday)
- Online portal for application opens
18th November, 2022 (Friday)
- Online portal for application closes
18th November, 2022 (Friday)
- Receipt of letters of recommendation by Referees closes
23rd November, 2022 (Wednesday)
- Last date of receipt of physical applications
26th November, 2022 (Saturday)
- Shortlisting candidates for written test
11th December, 2022 (Sunday) (tentative)
- Written test at 4 locations (Delhi, Calcutta, Mumbai, Chennai)
14th December, 2022 (Wednesday)
- Shortlisted candidates for personal interview
1st January, 2023 (Sunday)
- Personal interview at IIT Kanpur
03rd January, 2023 (Tuesday)
- Selected candidates for admission
Apply Now
FAQs
Are there any benefits with the certification
E&ICT Academy, IIT K Certification is considered highly valuable and with hands on experience, getting a job would become that much more easy.
Who is the target audience for this course?
- B.Tech/MCA/BCA/M.Tech Students
- Working Professionals from Corporate
Does the certification lead to an alumni status from IITK
No